| | | | 181. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 182. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 183. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 184. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 185. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 186. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 187. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 188. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 189. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 190. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 191. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 192. [China] | | The advantages of our product are following::
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickening the steel plate design
3, the patent protection, the fashi... | | | | | | | 193. [China] | | The advantages of our product are following::
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickening the steel plate design
3, the patent protection, the fashi... | | | | | | | 194. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 195. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 196. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 197. [China] | | Feature
1, the Intel 38 degrees standards design
2, the SECC first-level cathode board, thickens the steel plate to design
3, the patent protection, the fashionable modelling designs
4, the spe... | | | | | | | 198. [China] | | Specifications:
1) Drive Bays:
a) 5.25" x 4 (EXT)
b) 3.5" x 2 (EXT)
c) 3.5" x 5 (INT)
2) Mainboard: ATX
3) Expansion slots: 7
4) Optional front USB and multimedia port
5) Options: ... | | | | | | | 199. [China] | | Specifications: 1) Med tower case 2) Drive bays: 5.25" x 4 (EXT), 3.5" x 2 (EXT), 3.5" x 5 (INT)3) Mainboard: ATX 4) Expansion slot: 75) Option: 4 x 80mm fan or 2 x 80mm fan and 1 x 120... | | | | | | | 200. [China] | | Specifications: 1) Drive bays: a) 5.25" x 4 (EXT) b) 3.5" x 1 (EXT) c) 3.5" x 6 (INT) 2) Mainboard: ATX 3) Expansion slots: 7 4) Optional front USB and multimedia port 5) Options: 4 x 8... | | |
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